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Storage market divergence inflection point: DRAM spot rally slows, NAND rebound weak, 2027 supply-demand outlook in focus
In early August 2026, the global memory chip market shows clear divergence: TrendForce reports DRAM
Samsung quarterly profit soars 18-fold: AI chip boom puts Vietnam supply chain in investment spotlight
Samsung Electronics' operating profit in Q2 2026 surged 1,813.8% year-on-year to 89.49 trillion Kore
中微公司净利预增超280%：半导体设备“量价齐升”，国产替代进入收获期
国产半导体设备龙头中微公司发布2026年半年度业绩预告：营收约66.91亿元，同比增长34.89%；归母净利润预增282%至311%，扣非净利润增速亦超85%。在AI算力需求与国产替代双轮驱动下，全球
存储芯片史诗级行情延续：DRAM合约价创新高，2027年产能预售告罄
2026年8月，全球存储芯片市场延续史诗级涨价行情：DRAM合约价环比大涨14.3%创历史新高，NAND基准价突破30美元，存储原厂2027年产能预售一空。本文梳理DRAM/NAND最新价格走势、供需
半导体实战营升级：AI芯片设计课程上线，越南工程师实训基地扩容
随着全球半导体产业向AI加速转型，人才缺口持续扩大。越南半导体实战营宣布课程体系重大升级，新增AI芯片设计与先进封装模块，并在河内设立第二实训基地，旨在为越南及东南亚培养高端芯片设计人才，助力区域半导
2026年8月全球晶圆代工产能松动：成熟制程报价下调，先进制程溢价持续扩大
进入2026年8月，全球半导体晶圆代工市场呈现显著分化。受消费电子季节性调整及部分领域库存修正影响，28nm及以上成熟制程晶圆代工报价出现松动，平均降幅约5%-8%。与此同时，受AI芯片与高性能计算驱
TSMC 3nm Capacity Fully Booked Through 2027: AI Chip Demand Ignites Advanced Process Investment Boom
In August 2026, TSMC's 3nm process capacity remains fully loaded, with orders booked through 2027, d
越南半导体战略正式落地：芯片投资迎来黄金窗口期
2026年7月30日，越南政府正式批准《越南半导体产业发展战略（2026-2035）》，计划吸引超500亿美元投资，建设完整芯片产业链。本文深度解读越南在成本、地缘、政策上的多重优势，分析芯片投资长期
碳化硅功率半导体行情飙升，8英寸产线加速普及，越南供应链迎来新机遇
2026年Q2全球碳化硅功率器件市场规模同比增长22%，价格同比下降15%。随着8英寸产线加速渗透，SiC成本持续下探，新能源汽车、光伏需求爆发。越南凭借制造成本优势和封测产能扩张，正成为SiC供应链
Why invest in chips? Technical barriers and long-term growth build investment moat
This article deeply analyzes the core logic of chip investment from four dimensions: technical barri
NVIDIA Launches Blackwell B200 Chip, AI Chip Demand Triggers HBM4 Memory Price Surge
On July 30, 2026, NVIDIA officially launched the next-gen AI chip Blackwell B200 with 3nm process an
Advanced packaging capacity expansion accelerates, AI chip demand drives new semiconductor cycle
July 2026: Samsung, SK Hynix Q2 earnings beat estimates on robust AI memory demand; TSMC to double C
Investment Value of Automotive-grade Chips Highlights Amid Intelligent Vehicle Wave
As vehicle E/E architecture evolves towards domain-centralized, demand for automotive-grade chips su
Vietnam Semiconductor Bootcamp Launches in Ho Chi Minh City: A New Hub for IC Design and Packaging & Testing Talent
July 28, 2026: Vietnam's first major semiconductor bootcamp opened in HCMC, focusing on IC design &
Vietnam's new chipmaking breakthrough: 28nm process enters mass production, accelerating semiconductor self-reliance
In July 2026, Vietnamese semiconductor firm FPT Semiconductor announced mass production of 28nm chip
